This company is located in the Eastern Time Zone and the office is currently
Closed
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BGA Test and Technology Products:
Electrical Testing - Electronic Components
Programming Of IC’s
Comprehensive IC Counterfeit Detection Program
External Visual Microscopic Inspection
Resistance to Solvents Testing (Mark Permanency)
X-RAY Analysis (internal die inspection)
De-capsulation (internal die verification)
BGA Re-balling
PB-Free to PB Conversion – BGA Devices
PB to PB-Free Conversion - BGA Devices
BGA Solder Ball Attach
BGA Re-ball and Repair
Bake and Dry Pack
IC Recovery from boards
Lead Straightening Services
Lead Tinning Services
Estimated Shipping Rates from Holbrook, New York to
These costs are an estimate and cannot be used as actual shipping costs. Please contact BGA Test and Technology for a complete quote with shipping costs.
Shipment Type
Estimated Price
Pallet
$95
Crate
$100
Box
$95
Partial Dry Van
$720
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